Prior to joining Temasek in 2012, Boon was with Credit Suisse Group and its predecessor firm, The First Boston Corporation in New York. During his twenty-year career with Credit Suisse and First Boston, he held various leadership positions of increasing responsibility, last as Global Head of Mergers & Acquisitions and prior to that, as Head of US and Americas M&A Group and Co-Head of Technology Banking based in New York. He also served on the firm’s Global Operating Committee and Leadership Council.
Prior to joining The First Boston Corporation, Boon was a design engineer at Texas Instruments Inc., focusing on semiconductor design and process automation. He is currently a board member of the Canadian Pension Plan Investment Board. He is also a director of Artius II Acquisition Inc. (learn more). Boon is also a member of the Yale University SOM Board of Advisors. Born and raised in Singapore, Boon served as an Officer of the Singapore Army and was a Sword of Honor recipient. Boon holds a Master of Science (SM Engineering) from Massachusetts Institute of Technology, a Master of Private & Public Management (MPPM) from Yale University and a Bachelor of Engineering (BEng First Class Honors) from the National University of Singapore.